Epoxy resin Potting compound

Telephone Bargaining

Industry Category: Chemicals/Adhesives-Sealants
Product Category:
Brand:
Spec:
Send Inquiry Contact Info

Technical Data Sheet

■  Description

Two-component encapsulating system based on epoxy resin,formed from auxiliaries including epoxy resin, diluent, compound amine, cross-linking agent and defoamer by special production processing

 

Excellent of the flexibility of the cured epoxy resin, Heat/cold resistance is good, excellent of anti vibration 

 

■  Applications

The product is used as encapsulating material that has the advantages for both epoxy resin and polyurethane

 

■  General properties

Test Item

Test Mothed/Conditions

WOC-87-II-Q A

WOC-87-II-Q B

Appearance

Visualization

All color viscous liquid

Slight yellow transparent liquid

Density

25º C g/m³

1.35 – 1.50

0.93 – 0.96

Viscosity

40º C mpa.s

1000 - 5000

20 - 35

-

-

-

Storage validity

Sealed and storage Temp.below 25º C 

6 months

6 months

Ratio of blend

Weight/Weight

100

20-25

Curing condition

º C/hrs

25º C/48h or 60º C/4h

 

■  Characteristics after curing

Item

Unit/Conditions

WOC-87-II-Q A/B

Hardness

20º C Shore-A

 ≥60

Coefficient of linear expansion

Cm/cm/º C

 ＜0.5.34 x 10-5

Water absorption

25 º C/24hrs

 ＜0.1

Temperature Resistance

º C

 ≥70

Flame Retardancy

UL 94

V0 or V1

Heat/cold Shock Resistance

-20 to 80º C

 Cycle times: more than 10

Volume Resistance

25º C Ω.cm

 2 x 1010

Curing Shrinkage Rate

%

＜0.6

Industry Category Chemicals/Adhesives-Sealants
Product Category
Brand:
Spec:
Stock:
Origin: