High quality Multiplayer PCB assembly/PCB manufacturer in Shenzhen
$0.1/㎡
High quality Multiplayer PCB assembly/PCB manufacturer in Shenzhen
Product Description
Rigid PCB capability:
| Item | Technical Parameters | Specification | ||||||||||||
| Layers | 1-40 layers | _ | ||||||||||||
| Min. line width | 2/2mil | Partial 2mil lines is allowed | ||||||||||||
| Min. line space | 2/2mil | Partial 2mil lines is allowed | ||||||||||||
| Min.annular ring width: vias | 3mil | _ | ||||||||||||
| Min.annular ring width: component holes | 7mil | _ | ||||||||||||
| Min.hole size(board thickness <2mm) | 4mil | _ | ||||||||||||
| Min.hole size(board thickness ≥2mm) | Aspect ratio≤16 | _ | ||||||||||||
| Max.board thickness(single&doule sided) | 6mm | _ | ||||||||||||
| Max.board thickness(multilayer) | 8mm | _ | ||||||||||||
| Min.board thickness(single&doule sided) | 0.2mm | _ | ||||||||||||
| Min.board thickness(multilayer) | 4layers:0.4mm;6layers:0.6mm;8layers:1mm; 10layers:1.2mm | _ | ||||||||||||
| Max.board size (single&doule sided) | 700*1200mm | _ | ||||||||||||
| Max.board size (multilayer) | 700*1200mm | _ | ||||||||||||
| Distance between line to board edge | Outline: 0.2mm V-CUT: 0.4mm | _ | ||||||||||||
| Solder mask bridge | 4mil | Between IC pins | ||||||||||||
| Solder mask color | White,black,blue,green,yellow,red,ect | _ | ||||||||||||
| Legend color | White,black,yellow,ect | _ | ||||||||||||
| Surface finish | HAL(with Pb free),plated Ni/Au,Immersion silver,Imm Ni/Au,Imm Sn, hard gold,OSP,ect | _ | ||||||||||||
| Plating thickness(Technique: hard gold) | Plating type: Ni, Min./Max thickness:100/150U'' Plating type: Au, Min./Max thickness:5/120U'' | _ | ||||||||||||
| Plating thickness (Technique:Immersion Ni/Au) | Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U'' | _ | ||||||||||||
| Plating thickness (Technique: gold finger) | Plating type: Ni, Min./Max thickness:120/150U'' Plating type: Au, Min./Max thickness:5/120U'' | _ | ||||||||||||
| Copper plating hole | Copper thickness: Min.20um/Max.25um | _ | ||||||||||||
| Base copper thickness(Inner and outer layer) | Min. thickness:1/3 OZ Max.thickness:6OZ | _ | ||||||||||||
| Finished copper thickness | Outer layers: Min.thickness 1 OZ,Max.thickness 10 OZ Inner layers: Min.thickness 0.5 OZ,Max.thickness 6 OZ | _ | ||||||||||||
| Min.insulation layer thickness | 2mil | _ | ||||||||||||
| Line width/space: 3/3mil,4/4mil,4/5mil | Max. Copper thickness 0.5 OZ | Line width shouldn't be less than the required value under ensure of space | ||||||||||||
| Line width/space: 4/6mil,5/5mil,6/5mil | Max. Copper thickness 1 OZ | |||||||||||||
| Line width/space: 5/6mil,6/6mil | Max. Copper thickness 2 OZ | |||||||||||||
| Line width/space: 6/8mil,7/8mil,8/8mil | Max. Copper thickness 3 OZ | |||||||||||||
| Line width/space: 8/10mil,9/10mil,10/10mil | Max. Copper thickness 5 OZ | |||||||||||||
| Board materials | FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,PTFE,nelcon,ISOLA,polyclad 370 HR); thick copper | |||||||||||||
| Hole size tolerance | ±0.03mm | |||||||||||||
| Hole position tolerance | -->
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